3D Heterogeneous Integration (3DHI) rapidly emerges as the ideal integration solution for constructing high performance RF/MW/mmW hardware modules that comprise RFICs, MMICs, IC packaging, integrated passives, SMDs, interposers and phased array antenna elements. You will learn how 3DHI modules can be flexibly fabricated to accommodate these multi-technology components. The EDA tools needed to correctly assemble and interconnect these mixed technology components into a 3DHI structure will be demonstrated. Then learn how accurate circuit-EM cosimulation can be interactively performed on any selected RF paths through the 3DHI structure without disturbing the 3D layout. Finally, we appreciate how a 3DHI phased-array module can be accurately simulated for beam forming characteristics before HW fabrication.
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