Intelligent High Reliability PCB Stackup Design to Avoid Microvia, Plated Through Hole, Solder Joint, Warpage, Delamination, and Voiding Risks

Microvia, PTH, and solder joint reliability, warpage, and delamination risks can render a PCB inoperable. These are a function of the stackup, including the choice of materials and constructions. However, in the traditional approach, the PCB stackup is not given much importance, despite governing the board reliability. In this webinar, we will explain the factors that lead to these failure modes and introduce simulation software that predicts reliability at the stackup design stage.