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Microwave Journal editors Pat Hindle and Eric Higham celebrate the 250th episode of Frequency Matters plus review the products in the April Amplifiers and Oscillators themed issue, industry news and…
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Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
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Learn how MATLAB and Simulink can be used to design RF transceivers with integrated antenna array for wideband communication systems, radar, and smart location devices, where a combination of…
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Stan Oda, Product Marketing Manager for Test & Measurement at Mini-Circuits talks with Pat Hindle, Media Director at Microwave Journal, about the trends in test/measurement and…
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Mini-Circuits Director of Engineering, Michael Ciardullo, and Product Marketing Manager for Connectorized Amplifiers and Waveguides, Chandra Gupta, talk with Microwave Journal Editor, Gary Lerude,…
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See how to properly apply a staking compound to an electronic component for enhanced mechanical reinforcement. Learn how to apply the material on components of differing sizes and shapes as well as…
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Microwave Journal/Signal Integrity Journal Editorial Director, Pat Hindle, talks with SnapEDA Founder and CEO, Natasha Baker, about the genesis of the company and how engineers can save time…
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Learn about open-weave, spread-weave, and non woven-glass types of prepreg/bondply and how they perform at millimeter-wave frequencies.
Register to become a member of the Technology Support Hub…
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Wissam Saabe, Application Engineer at AMCAD Engineering, discusses transistor behavioral modeling for circuit design, and circuit behavioral modeling for system design. Wissam starts by introducing…
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Teledyne Paradise discussion on using the Dual L/S band SSPA for TT&C.
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In order to have complete confidence in your S-parameter measurements , it is critical to characterize the uncertainty contribution of each aspect of your test setup.
Starting with the VNA,…
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This video shows how to extract a GaN FET transistor compact model from pulsed IV and pulsed S parameter measurements using IVCAD, and export the model in NI-AWR circuit simulato Microwave Office.
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This video explains how to extract a behavioral model of an RF power amplifier, and use this model into a system simulator.
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Professor Collantes from UPV/EHU introduces a setup to characterize a frequency divider based on a varactor diode. Using STAN Tool he demonstrates how to analyze the dynamics and the critical poles…
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In this edition of Coonrod’s Corner, John Coonrod talks about understanding Dk measurements at millimeter-wave frequencies. There are many different test methods which can be used to determine…
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In this episode of Coonrod’s Corner, John Coonrod explains the impact that plated finishes have on PCB high frequency performance at millimeter-wave frequencies. There are many different plated…
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