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Fortify 3D Printing Innovations

Fortify discusses their 3D printing innovations at IMS 2023 in San Diego including a field of view enhancing lenses that increases phased array field of view from +/- 60 to 90 degrees and others.

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Challenges in Hypersonics: Interview with Times Microwave

David Slack, Director of Engineering at Times Microwave, talks with Gary Lerude, Editor at Microwave Journal, about the hypersonic market and the challenges for RF and microwave companies in various…

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Frequency Matters, June 3: Semiconductor Issue, Mini-Circuits Interview, Industry News/IMS2022

Microwave Journal Media Director, Pat Hindle, talks with guest co-host, Fred Schindler, about the June Semiconductor/IC issue, Mini-Circuits Interview about LTCC technology, industry news from…

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Direct Conversion RF SATCOM Solution to Ka-Band

Teledyne e2v Semiconductors demonstrates their proto-type direct conversion RF solution for SATCOM applications through Ka-Band showing the performance at several bands. Sponsored by Teledyne e2v…

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First Hub Canceller Embedded in a Modem

Teledyne Paradise Datacom dicusses the SATCOM Industry's first Hub Canceller embedded in a modem.

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5G O-RAN O-RU Radio Unit

Demonstration of Analog Devices (ADI) 5G O-RAN O-RU based on the ADRV9026 (and future variants) and NXP’s AFLP5G35645 / AFSC5G35E37. Learn more at RichardsonRFPD.com/AnalogDevices

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5G O-RAN O-RU Radio Unit

Demonstration of Analog Devices (ADI) 5G O-RAN O-RU based on the ADRV9026 (and future variants) and NXP’s AFLP5G35645 / AFSC5G35E37. Learn more at RichardsonRFPD.com/AnalogDevices

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Most Advanced Microwave Capable ADC Sampling Ssignal Waveforms in Multiple Frequency Bands up to KA

You will see the first live demonstration of the most advanced Analog-to-Digital Converter (ADC) demonstrator chip from Teledyne e2v: PS640. This proof-of-concept is capable of microwave direct…

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Frequency Matters, Sept 8: mmWave Components/Packaging Issue, News & Events

Microwave Journal editors Pat Hindle and Gary Lerude cover the technical articles in the Sept mmWave Components and Packaging issue, 5G/SATCOM news and upcoming events. Sponsored by WTG and RFMW.

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5G in 60: RF Challenges in 5G Handsets

5G (https://www.qorvo.com/innovation/5g) wasn't built in a day and is sure to bring the toughest RF complexities the industry has ever seen. Qorvo's Eric Creviston explains why 5G…

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