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Microwave Journal editors Pat Hindle and Eric Higham review the articles in the March Test and Measurement themed issue, show automatic fixture removal software demo and review the latest industry…
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David Kiesling and Kai Loh of Times Microwave Systems talk with Pat Hindle of Microwave Journal about the challenges of designing and manufacturing cables for commercial space applications and how…
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Fortify discusses their 3D printing innovations at IMS 2023 in San Diego including a field of view enhancing lenses that increases phased array field of view from +/- 60 to 90 degrees and others.
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FAQ: Why is CTE important in surface mount filters?
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FAQ: Why are Build-to-Print Thin Film Filters not always the answer?
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Wayne Johnson, SVP of Sales and Business Development at IQE, discusses epi wafer market trends and material technologies with Pat Hindle, Media Director at Microwave Journal. Sponsored by IQE.
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Ed Liang, CTO and Co-founder of MCV Microwave, talks with Pat Hindle, Media Director at Microwave Journal, about unique ceramic materials that enable high performance filters and other products.
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In this episode of Reel Times, our Applications Engineer for Test and Measurement Assemblies joins Carrie to talk about VNA. Watch to learn about the requirements for VNA applications and the…
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Learn about open-weave, spread-weave, and non woven-glass types of prepreg/bondply and how they perform at millimeter-wave frequencies.
Register to become a member of the Technology Support Hub…
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John Ekis of Rogers Corp reviews the market trends in the high performance RF areas plus some new products that Rogers is offering to these markets at IMS2021.
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Learn about the advantages and performance improvements that additive manufactured electronics bring to the high frequency market from Jaim Nulman, CTO and eVP at Nano Dimension, as he talks with…
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In this edition of Coonrod’s Corner, John Coonrod discusses RF influences due to hole wall roughness of plated through hole technology for applications in the frequency range for 5G and…
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Microwave Journal editor Pat Hindle talks with John Coonrod of Rogers about the PCB needs and challenges for 5G mmWave applications at IMS2019.
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Microwave Journal editor Pat Hindle talks with Scott Kennedy of Rogers about the market needs driving higher thermal conductivity PCB materials and Rogers new TC350 Plus at IMS2019.
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