Microwave Journal Media Director, Pat Hindle, talks with guest co-host, Fred Schindler, about the June Semiconductor/IC issue, Mini-Circuits Interview about LTCC technology, industry news from…
Microwave Journal editors Pat Hindle and Gary Lerude cover the technical articles in the Sept mmWave Components and Packaging issue, 5G/SATCOM news and upcoming events. Sponsored by WTG and RFMW.
5G (https://www.qorvo.com/innovation/5g) wasn't built in a day and is sure to bring the toughest RF complexities the industry has ever seen. Qorvo's Eric Creviston explains why 5G…