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UV15RCL adhesive is a UV curable, optically clear compound that changes from red to clear once exposed to UV light. This distinctive feature gives users the confidence that thorough penetration of UV…
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Master Bond MasterSil 170 Gel is a two component gel system with a low mixed viscosity of 1,000 cps. It is ideal for use in potting and encapsulation applications where sensitive components are…
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Wayne Johnson, SVP of Sales and Business Development at IQE, discusses epi wafer market trends and material technologies with Pat Hindle, Media Director at Microwave Journal. Sponsored by IQE.
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David Vye, Senior Product Marketing Manager at Cadence, discusses the innovations the AWR group is making with the overall Cadence portfolio of products at EuMW 2022 in Milan.
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See how to properly apply a staking compound to an electronic component for enhanced mechanical reinforcement. Learn how to apply the material on components of differing sizes and shapes as well as…
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Teledyne e2v HiRel Electronics discussion - building compound semiconductors and RF components for Space.
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Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create…
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Our new video offers a look at MasterSil 930’s enhanced resistance to high temperature and a wide range of chemicals including fuels, oils and solvents. This fluorosilicone system has a paste…
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