Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create…
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. Independent tests demonstrate that this epoxy’s abrasion resistance value is significantly higher than…
For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched one on one technical…