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How Do You Use EP4EN 80 for Potting & Encapsulation Applications

With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used…

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EP4S-80: One Part, Silver Filled Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. This NASA low outgassing approved system cures at the low temperature of 80˚C and bonds well to a variety…

From  Microwave Journal 0 likes 408 plays 0  

Teledyne Paradise Datacom Facility Tour 2021

Take a tour of the all new Teledyne Paradise Datacom RF Power Center of Excellence in Rancho Cordova, California.

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Understanding GaN Thermal Analysis

This video demonstrates how Qorvo determines reliability and thermal resistance for GaN devices. You can also refer to the GaN application note GaN Device Channel Temperature, Thermal Resistance, and…

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