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With its thin bond line thickness and low viscosity, EP4EN-80 is ideal for bonding, encapsulating and potting applications. Watch a real-life demonstration of how this epoxy compound can be used…
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Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
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Watch our latest video to learn about the key properties of Master Bond Supreme 18TC. This one part conductive epoxy features very low thermal resistance properties and meets NASA low outgassing…
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Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies.…
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Microwave Journal editor Pat Hindle talks with Scott Kennedy of Rogers about the market needs driving higher thermal conductivity PCB materials and Rogers new TC350 Plus at IMS2019.
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