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Master Bond epoxies feature outstanding physical strength properties for high performance bonding, sealing, coating, potting and encapsulation. Our polymer compounds are formulated to meet…
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Dr. Laila Salman, Principal Technical Specialist at Ansys, talks about the Ansys Innovation Conference Interview taking place Nov 2 in Santa Clara, CA. Register now at https://upl.inc/aksavn.
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Microwave Journal editors Pat Hindle and Gary Lerude cover the April Amplifier and Oscillator issue articles, talk with RF power experts from RFMW, review industry partnership news and upcoming…
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For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched one on one technical…
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Microwave Journal editors Pat Hindle and Gary Lerude review the technical articles for the 5G and IoT Nov issue, industry news/products and virtual events including EuMW 2020 announcement of going…
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Since 2G, RF has evolved at a rapid pace. 5G (https://www.qorvo.com/innovation/5g) will drive the need for higher integration and smaller solution sizes to combat increasing complexity.
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