Master Bond epoxies feature outstanding physical strength properties for high performance bonding, sealing, coating, potting and encapsulation. Our polymer compounds are formulated to meet…
Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
For over 40 years, Master Bond has been custom formulating advanced adhesive, sealing, coating, potting and encapsulation compounds for high tech industries. We offer unmatched one on one technical…