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Oct 26, 2023Tom Kole, Vice President of Sales and Marketing at Integra Technologies, talks with Pat Hindle about the latest market trends in high power RF, new levels of high power being achieved by…
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Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
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Tom Kole, Vice President of Sales and Marketing at Integra Technologies, talks with Pat Hindle, Media Director at Microwave Journal, about the significant improvements in SWAP-C from the use of high…
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Eric Bonelli, Application Engineer at Wolfspeed, demonstrates a 200 W, dual transistor, S-Band pallet with about 44% efficiency at 2.5 GHz and about 36 dB large signal gain.
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Microwave Journal Editors Pat Hindle and Gary Lerude cover the May 5G and IMS issue articles, talk with Integra Technologies VP of Sales and Marketing, Tom Kole, and review industry news and events.…
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Integra Technologies VP of Sales and Marketing talks with Microwave Journal Editors Pat Hindle and Gary Lerude about the high power transistor market and their new innovative modular solution that…
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Microwave Journal editors Pat Hindle and Gary Lerude cover the July Software & Design issue products, latest industry news/events and talk with Integra RF Power Devices executives about their…
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Microwave Journal editors Pat Hindle and Gary Lerude talk with Tom Kole, Vice President of Sales and Marketing, and Apet Barsegyan, Vice President, Chief Operating Officer, at Integra RF Power…
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