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Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
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An overview of the GUI for Empower RF’s Model 2244, a pulse high power liquid cooled amplifier. The local and remote interfaces are the same and shown in this live demo. Parameters covered…
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Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Supreme 3HTND-2DM-1 to create…
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NXP RF GaN Fab manager Geno Fallico recalls his journey. Learn about how the site in Chandler, Arizona was selected and what it took to assemble the team and equipment for a successful opening to GaN…
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This video explains how to extract a behavioral model of an RF power amplifier, and use this model into a system simulator.
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