Rogers corporation discusses COOLSPAN TECA, a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards with Microwave Journal editor, Eric Higham, at IMS 2023…
Fortify discusses their 3D printing innovations at IMS 2023 in San Diego including a field of view enhancing lenses that increases phased array field of view from +/- 60 to 90 degrees and others.